Silicon carbide (SiC) mea tioata tasi o loʻo i ai le lautele o le va tele (~ Si 3 taimi), conductivity vevela maualuga (~ Si 3.3 taimi po o GaAs 10 taimi), maualuga electron saturation fua faatatau (~ Si 2.5 taimi), eletise malepe maualuga. fanua (~ Si 10 taimi po o GaAs 5 taimi) ma isi uiga mataʻina.
O le vaega lona tolu o mea semiconductor e masani ona aofia ai SiC, GaN, taimane, ma isi, aua o lona lautele gap lautele (Eg) e sili atu pe tutusa ma le 2.3 electron volts (eV), e lauiloa foi o mea lautele gap semiconductor mea. Pe a faatusatusa i mea semiconductor augatupulaga muamua ma lona lua, o le lona tolu o augatupulaga semiconductor mea e maua ai le tulaga lelei o le conductivity vevela maualuga, fanua malepe eletise maualuga, maualuga saturated electron fua faatatau femalagaiga ma le malosi fusia maualuga, lea e mafai ona ausia manaoga fou o tekinolosi faaonaponei mo le maualuga. vevela, malosi maualuga, maualuga maualuga, maualuga taimi ma faʻavevela tetee ma isi tulaga faigata. O loʻo i ai faʻamoemoega faʻaoga taua i vaega o le puipuiga a le atunuʻu, vaʻalele, aerospace, suʻesuʻega suauʻu, teuina o mata, ma isi, ma e mafai ona faʻaitiitia le malosi o le malosi e sili atu i le 50% i le tele o pisinisi faʻapitoa e pei o fesoʻotaʻiga lautele, malosi o le la, gaosiga o taavale, moli semiconductor, ma smart grid, ma e mafai ona faaitiitia le tele o meafaigaluega e sili atu i le 75%, lea e taua tele mo le atinaeina o le faasaienisi ma tekinolosi tagata.
Semicera malosi e mafai ona tuʻuina atu i tagata faʻatau le tulaga maualuga Conductive (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; E le gata i lea, e mafai ona matou tuʻuina atu i tagata faʻatau i le tutusa ma le heterogeneous silicon carbide epitaxial sheets; E mafai foi ona matou faʻavasegaina le pepa epitaxial e tusa ai ma manaʻoga faʻapitoa o tagata faʻatau, ma e leai se faʻatonuga maualalo.
FAAMATALAGA WAFERING
*n-Pm=n-ituaiga Pm-Vaega,n-Ps=n-ituaiga Ps-Vaega,Sl=Semi-lnsulating
Aitema | 8-Inisi | 6-Inisi | 4-Inisi | ||
nP | n-Pm | n-Sa | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Aufana(GF3YFCD)-Taua atoatoa | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
A'ai(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR)-10mmx10mm | <2μm | ||||
Wafer Edge | Fa'ata'oto |
FA'ATA'U LUGA
*n-Pm=n-ituaiga Pm-Vaega,n-Ps=n-ituaiga Ps-Vaega,Sl=Semi-Insulating
Aitema | 8-Inisi | 6-Inisi | 4-Inisi | ||
nP | n-Pm | n-Sa | SI | SI | |
Fa'ai'uga | Itulua Optical Polish, Si- Face CMP | ||||
Lau'ele'ele | (10um x 10um) Si-FaceRa≤0.2nm C-Face Ra≤ 0.5nm | (5umx5um) Si-Face Ra≤0.2nm C-Face Ra≤0.5nm | |||
Tipi Chips | Leai se Fa'ataga (umi ma le lautele≥0.5mm) | ||||
Indents | Leai se Fa'ataga | ||||
Manu'ese(Si-Fua'i) | Qty.≤5, Fa'aopoopo Length≤0.5×wafer diameter | Qty.≤5, Fa'aopoopo Length≤0.5×wafer diameter | Qty.≤5, Fa'aopoopo Length≤0.5×wafer diameter | ||
Ta'eta'ei | Leai se Fa'ataga | ||||
Tuusaunoaga Tupito | 3mm |